The K-Px adhesive range developed and patented by Kloé is synthetized with organomineral precursors. The final compound is hybrid structure made up of two interleaved networks: one organic, the other one inorganic.

Traditionally the inorganic network is thermically cured, while the organic network is obtained by UV insolation. So K-Px adhesives cure thermically, by insolation or by a combination of both processes.

Thanks to the presence of an inorganic network in the final structure, our adhesives present stable mechanical and thermal properties.

Kloé has also developed its own K-CL lithography negative resins range based on hybrid organic-inorganic materials.

The presence of a mineral network in the structure gives these resins specific mechanical properties, such as a strong resistance to semiconductors wet etching solutions, to RIE, DRIE and plasma dry etching solutions. These resins are also compatible with high form factors (>10) because of their mechanical structure.

The hybrid composition of K-CL resins allows to adjust the threshold sensitivity and thus to obtain very high resolutions and lithography angles of 90°.

Thanks to their composition, K-CL resins can be used at wavelengths beyond 405 nm.

The flexibility of the hybrid sol-gel process allows the development of a broad range of materials with adjustable properties. The large selection of available precursors leads to a broad range of mechanical, optical and physicochemical properties.
Thanks to this know-how, Kloé developed a range of specific coatings, such as K-CH and K-CA, such as antiscratch, antireflective, hydrophobic, hydrophile layers or other.