Kloé proposes a new flexible and low cost process of lithography of submicronic precision on high thicknesses (about 10 µm) and on large surfaces (4 inches and more) to micro-electronics and MEMS professionals.

Hybrid materials (organic-inorganic) developed for this process are resistant to a broad range of chemical and dry etchings such as RIE and DRIE.

A service of rapid prototyping and production in small and average series is also provided.